Business SegmentsSemiconductor
Semiconductor
Wedge Bond series wire bonders, IGBT module bonders, MOSFET power device bonders, and CCD vision inspection systems
Core Products
IGBT Module Wire Bonding Machine
Core product of the Wedge Bond series: aluminum wire bonding for IGBT power modules.
MOSFET Power Device Wire Bonding Machine
High-Precision Wire Bonding Solutions for MOSFET Devices
CCD Vision Inspection Equipment
Weld Point Quality Inspection System Based on Visual Automatic Positioning Technology
Technical Advantages
1
Self-developed ultrasonic generator
2
Digital closed-loop pressure control
3
Visual Auto-Positioning
4
Multi-axis Precision Motion System
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