Precision Automation Equipment

Intelligent Automation EquipmentSolution

Deepening expertise in semiconductor ultrasonic wire bonding, we deliver high-reliability automated equipment solutions for the new energy and semiconductor industries.

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Year Founded

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Patented Technology

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Serve Customers

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Oversee the industry

Company Qualifications and Strength

National High-Tech Enterprise with multiple proprietary patents, driving continuous technological innovation

19

National High-Tech Enterprise

2019

21

Provincial Specialized and New Enterprise

2021

25

100+Autonomous Patents

2013-2025

20

ISO001 Certification

2020