Industry SolutionsSemiconductor

SemiconductorIndustry

IGBT/SiC Power Semiconductor Packaging and Applications in Automotive Electronics

Semiconductor

Industry Solutions

Power Module Packaging
SiC device bonding
Chip interconnect solutions

Semiconductor Equipment Showcase

3-axis ultrasonic aluminum wire bonding equipment

Three-axis Ultrasonic Aluminum Wire Bonding Equipment

Dual-head ultrasonic aluminum wire bonding equipment

Dual-head ultrasonic aluminum wire bonding equipment

Terminal Product Showcase

IGBT Module Wedge Bonding

IGBT Module Wedge Bonding

Semiconductor Chip Bonding Process

Semiconductor Chip Bonding Process

Aluminum strip bonding for power modules

Power module aluminum strip bonding

Chip copper tape bonding

Chip copper tape bonding

Aluminum strip ultrasonic bonding

Aluminum strip ultrasonic bonding

Multi-module bonding

Multi-module bonding

Power Semiconductor Modules

Power Semiconductor Modules

Copper terminal bonding connection

Copper terminal bonding connection

IGBT Module Terminal Connection

IGBT Module Terminal Connection

MOSFET semiconductor device

MOSFET semiconductor device

MOSFET Power Transistor

MOSFET Power Transistor

Guangdong ICP File No. 2023103429-1