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Product videos and technical docs to help you explore our equipment and solutions in depth.
Product Video
Device Operation Demo and Technical Overview
3:45Semiconductor
Ultrasonic Aluminum Wire Bonding for MOSFET Power Device Welding Demonstration
Real-world footage of ultrasonic aluminum wire bonding, enabling precision interconnection for MOSFETs, power transistors, and Schottky diodes. Widely used in power modules, new energy devices, industrial power components, and semiconductor discrete device packaging.
3:30Semiconductor
Ultrasonic Aluminum Wire Bonding: Sample Gallery
IGBT modules, TO252, battery tab terminals, BMS sampling wires, and cell series-parallel connections—all handled. Extendable to automotive ECUs, photovoltaic inverters, medical electronics, and RF modules. Room-temperature bonding with no solder, atomic-level connections, high vibration resistance, and low internal resistance.