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Device Operation Demo and Technical Overview
Ultrasonic Aluminum Wire Bonding for MOSFET Power Device Welding Demonstration
Real-world footage of ultrasonic aluminum wire bonding, enabling precision interconnection for MOSFETs, power transistors, and Schottky diodes. Widely used in power modules, new energy devices, industrial power components, and semiconductor discrete device packaging.
Battery Revolution: The Technological Leap from Lead-Acid to Lithium-Ion
The era of lead-acid batteries is ending. Lithium-ion batteries are lighter, last longer, and benefit from advanced manufacturing innovations like ultrasonic aluminum wire bonding for molecular-level fusion. This boosts weld strength by 50% and reduces resistance by 40%. Safer, more efficient, and cost-effective—this isn't just a tech upgrade; it's the inevitable future of the new energy industry!
Ultrasonic Aluminum Wire Bonding: Sample Gallery
IGBT modules, TO252, battery tab terminals, BMS sampling wires, and cell series-parallel connections—all handled. Extendable to automotive ECUs, photovoltaic inverters, medical electronics, and RF modules. Room-temperature bonding with no solder, atomic-level connections, high vibration resistance, and low internal resistance.
BIC Power Module vs. Cell Welding: Wire Gauge Selection
BIC aluminum wire bonding commonly uses 4~20 mil diameter wires for high current applications, while cell welding typically employs 4~12 mil wires to connect terminals and sampling circuits. Wire diameter determines current capacity—matching the right size to your needs is key. Ultrasonic aluminum wire bonding: one-stop solution from semiconductors to power batteries.